Commit 086965be authored by Ruben Undheim's avatar Ruben Undheim

New upstream version 0.0.35+dfsg.1

parent 7097a4ea
**********************************************************************
* Exports the board to HyperLynx Signal-Integrity Transfer Format (.HYP)
* Version 2.00 9/11/97 -- 4.15 12/03/2012
*
* EAGLE Version 6.3.0 Copyright (c) 1988-2012 CadSoft
*
* HyperLynx Board exported from:
* /eagle/hairpinfilter/hairpinfilter.brd
* At 4/2/13 10:46 AM
*
* Schematic is loaded.
*
{VERSION=2.10} Compatible with Hyperlynx version 2.10.
{UNITS=ENGLISH LENGTH}
**********************************************************************
* Board Dimensions
*
{BOARD
(PERIMETER_SEGMENT X1=0.0000 Y1=0.0000 X2=1.7970 Y2=0.0000) Wires: From Board
(PERIMETER_SEGMENT X1=1.7970 Y1=0.0000 X2=1.7970 Y2=1.6996) Wires: From Board
(PERIMETER_SEGMENT X1=1.7970 Y1=1.6996 X2=0.0000 Y2=1.6996) Wires: From Board
(PERIMETER_SEGMENT X1=0.0000 Y1=1.6996 X2=0.0000 Y2=0.0000) Wires: From Board
}
**********************************************************************
* Thickness of Copper and Dielectric Layer Data
*
{STACKUP
(SIGNAL T=0.00070 P=0.00070 L=Top)
(DIELECTRIC T=0.05970 C=4.80000 L=DL01)
(SIGNAL T=0.00070 P=0.00070 L=Bottom)
}
* Total Board Thickness 0.0625 inch
**********************************************************************
* Components
*
{DEVICES
(? REF="TP1" NAME="TPTP10SQ" L="Top") R000 X=0.3900 Y=0.2500 : Lib: testpad : TP10SQ : Pins 1
(? REF="TP2" NAME="TPTP10SQ" L="Top") R000 X=0.5000 Y=0.4500 : Lib: testpad : TP10SQ : Pins 1
(? REF="TP3" NAME="TPTP10SQ" L="Top") R000 X=0.8600 Y=1.3500 : Lib: testpad : TP10SQ : Pins 1
(? REF="TP4" NAME="TPTP10SQ" L="Top") R000 X=1.2200 Y=0.4500 : Lib: testpad : TP10SQ : Pins 1
(? REF="TP5" NAME="TPTP10SQ" L="Top") R000 X=1.5100 Y=0.2500 : Lib: testpad : TP10SQ : Pins 1
(? REF="TP6" NAME="TPTP10SQ" L="Bottom") R000 X=0.2500 Y=0.1500 : Lib: testpad : TP10SQ : Pins 1
(? REF="TP7" NAME="TPTP10SQ" L="Bottom") R000 X=1.6500 Y=0.1500 : Lib: testpad : TP10SQ : Pins 1
}
**********************************************************************
* Pads, Smds, and Via Library
*
{PADSTACK=SMD001
(Top,1,0.039,0.039,0.0) ISASMD Shape was Smd and is now Smd
}
{PADSTACK=SMD002
(Bottom,1,0.039,0.039,180.0) ISASMD Shape was Smd and is now Smd
}
**********************************************************************
* Nets
*
{NET=GND
(PIN X=0.2500 Y=0.1500 R=TP6.TP P=SMD002) GND, Smd Dx: 0.0394 Dy: 0.0394
(PIN X=1.6500 Y=0.1500 R=TP7.TP P=SMD002) GND, Smd Dx: 0.0394 Dy: 0.0394
* (PLG Isolate=0.0000 Spacing=0.0500 Width=0.0000 Orphans=Off Pour=SOLID Thermals=Off Layer=Bottom) Polygon GND Data
{POLYGON L="Bottom" T=POUR W=0 ID=1 X=1.7570 Y=1.6596
(LINE X=1.7570 Y=0.0400 ) Polygon GND
(LINE X=0.0400 Y=0.0400 ) Polygon GND
(LINE X=0.0400 Y=1.6596 ) Polygon GND
(LINE X=1.7570 Y=1.6596 ) Polygon GND
}
}
{NET=V1
(PIN X=0.3900 Y=0.2500 R=TP1.TP P=SMD001) V1, Smd Dx: 0.0394 Dy: 0.0394
* (PLG Isolate=0.0000 Spacing=0.0500 Width=0.0000 Orphans=Off Pour=SOLID Thermals=Off Layer=Top) Polygon V1 Data
{POLYGON L="Top" T=POUR W=0 ID=2 X=0.4400 Y=1.4000
(LINE X=0.4400 Y=0.2000 ) Polygon V1
(LINE X=0.3400 Y=0.2000 ) Polygon V1
(LINE X=0.3400 Y=1.4000 ) Polygon V1
(LINE X=0.4400 Y=1.4000 ) Polygon V1
}
}
{NET=V2
(PIN X=0.5000 Y=0.4500 R=TP2.TP P=SMD001) V2, Smd Dx: 0.0394 Dy: 0.0394
* (PLG Isolate=0.0000 Spacing=0.0500 Width=0.0000 Orphans=Off Pour=SOLID Thermals=Off Layer=Top) Polygon V2 Data
{POLYGON L="Top" T=POUR W=0 ID=3 X=0.7300 Y=1.4000
(LINE X=0.7300 Y=0.4000 ) Polygon V2
(LINE X=0.6300 Y=0.4000 ) Polygon V2
(LINE X=0.6300 Y=1.4000 ) Polygon V2
(LINE X=0.5500 Y=1.4000 ) Polygon V2
(LINE X=0.5500 Y=0.4000 ) Polygon V2
(LINE X=0.4500 Y=0.4000 ) Polygon V2
(LINE X=0.4500 Y=1.4000 ) Polygon V2
(LINE X=0.5500 Y=1.5000 ) Polygon V2
(LINE X=0.6300 Y=1.5000 ) Polygon V2
(LINE X=0.7300 Y=1.4000 ) Polygon V2
}
}
{NET=V3
(PIN X=0.8600 Y=1.3500 R=TP3.TP P=SMD001) V3, Smd Dx: 0.0394 Dy: 0.0394
* (PLG Isolate=0.0000 Spacing=0.0500 Width=0.0000 Orphans=Off Pour=SOLID Thermals=Off Layer=Top) Polygon V3 Data
{POLYGON L="Top" T=POUR W=0 ID=4 X=0.8100 Y=0.4000
(LINE X=0.8100 Y=1.4000 ) Polygon V3
(LINE X=0.9100 Y=1.4000 ) Polygon V3
(LINE X=0.9100 Y=0.4000 ) Polygon V3
(LINE X=0.9900 Y=0.4000 ) Polygon V3
(LINE X=0.9900 Y=1.4000 ) Polygon V3
(LINE X=1.0900 Y=1.4000 ) Polygon V3
(LINE X=1.0900 Y=0.4000 ) Polygon V3
(LINE X=0.9900 Y=0.3000 ) Polygon V3
(LINE X=0.9100 Y=0.3000 ) Polygon V3
(LINE X=0.8100 Y=0.4000 ) Polygon V3
}
}
{NET=V4
(PIN X=1.2200 Y=0.4500 R=TP4.TP P=SMD001) V4, Smd Dx: 0.0394 Dy: 0.0394
* (PLG Isolate=0.0000 Spacing=0.0500 Width=0.0000 Orphans=Off Pour=SOLID Thermals=Off Layer=Top) Polygon V4 Data
{POLYGON L="Top" T=POUR W=0 ID=5 X=1.4500 Y=1.4000
(LINE X=1.4500 Y=0.4000 ) Polygon V4
(LINE X=1.3500 Y=0.4000 ) Polygon V4
(LINE X=1.3500 Y=1.4000 ) Polygon V4
(LINE X=1.2700 Y=1.4000 ) Polygon V4
(LINE X=1.2700 Y=0.4000 ) Polygon V4
(LINE X=1.1700 Y=0.4000 ) Polygon V4
(LINE X=1.1700 Y=1.4000 ) Polygon V4
(LINE X=1.2700 Y=1.5000 ) Polygon V4
(LINE X=1.3500 Y=1.5000 ) Polygon V4
(LINE X=1.4500 Y=1.4000 ) Polygon V4
}
}
{NET=V5
(PIN X=1.5100 Y=0.2500 R=TP5.TP P=SMD001) V5, Smd Dx: 0.0394 Dy: 0.0394
* (PLG Isolate=0.0000 Spacing=0.0500 Width=0.0000 Orphans=Off Pour=SOLID Thermals=Off Layer=Top) Polygon V5 Data
{POLYGON L="Top" T=POUR W=0 ID=6 X=1.5600 Y=1.4000
(LINE X=1.5600 Y=0.2000 ) Polygon V5
(LINE X=1.4600 Y=0.2000 ) Polygon V5
(LINE X=1.4600 Y=1.4000 ) Polygon V5
(LINE X=1.5600 Y=1.4000 ) Polygon V5
}
}
**********************************************************************
* End of data
*
{END}
{KEY=028-015E-4E5D}
**********************************************************************
* Exports the board to HyperLynx Signal-Integrity Transfer Format (.HYP)
* Version 2.00 9/11/97 -- 4.15 12/03/2012
*
* EAGLE Version 6.3.0 Copyright (c) 1988-2012 CadSoft
*
* HyperLynx Board exported from:
* /eagle/notchfilter/notchfilter.brd
* At 11/15/12 8:07 AM
*
* Schematic is loaded.
*
{VERSION=2.10} Compatible with Hyperlynx version 2.10.
{UNITS=ENGLISH LENGTH}
**********************************************************************
* Board Dimensions
*
{BOARD
(PERIMETER_SEGMENT X1=0.0000 Y1=0.0000 X2=2.0000 Y2=0.0000) Wires: From Board
(PERIMETER_SEGMENT X1=2.0000 Y1=0.0000 X2=2.0000 Y2=1.5000) Wires: From Board
(PERIMETER_SEGMENT X1=2.0000 Y1=1.5000 X2=0.0000 Y2=1.5000) Wires: From Board
(PERIMETER_SEGMENT X1=0.0000 Y1=1.5000 X2=0.0000 Y2=0.0000) Wires: From Board
}
**********************************************************************
* Thickness of Copper and Dielectric Layer Data
*
{STACKUP
(SIGNAL T=0.00070 P=0.00070 L=Top)
(DIELECTRIC T=0.05970 C=4.80000 L=DL01)
(SIGNAL T=0.00070 P=0.00070 L=Bottom)
}
* Total Board Thickness 0.0625 inch
**********************************************************************
* Components
*
{DEVICES
(? REF="TP1" NAME="TPTP10SQ" L="Top") R000 X=0.1500 Y=0.7000 : Lib: testpad : TP10SQ : Pins 1
(? REF="TP2" NAME="TPTP10SQ" L="Bottom") R000 X=0.1500 Y=0.7000 : Lib: testpad : TP10SQ : Pins 1
(? REF="TP3" NAME="TPTP10SQ" L="Top") R000 X=1.8500 Y=0.7000 : Lib: testpad : TP10SQ : Pins 1
(? REF="TP4" NAME="TPTP10SQ" L="Bottom") R000 X=1.8500 Y=0.7000 : Lib: testpad : TP10SQ : Pins 1
}
**********************************************************************
* Pads, Smds, and Via Library
*
{PADSTACK=SMD001
(Top,1,0.039,0.039,0.0) ISASMD Shape was Smd and is now Smd
}
{PADSTACK=SMD002
(Bottom,1,0.039,0.039,180.0) ISASMD Shape was Smd and is now Smd
}
**********************************************************************
* Nets
*
{NET=GND
(PIN X=0.1500 Y=0.7000 R=TP2.TP P=SMD002) GND, Smd Dx: 0.0394 Dy: 0.0394
(PIN X=1.8500 Y=0.7000 R=TP4.TP P=SMD002) GND, Smd Dx: 0.0394 Dy: 0.0394
* (PLG Isolate=0.0000 Spacing=0.0500 Width=0.0000 Orphans=Off Pour=SOLID Thermals=Off Layer=Bottom) Polygon GND Data
{POLYGON L="Bottom" T=POUR W=0.0000 ID=1 X=1.9500 Y=1.4500
(LINE X=1.9500 Y=0.0500 ) Polygon GND
(LINE X=0.0500 Y=0.0500 ) Polygon GND
(LINE X=0.0500 Y=1.4500 ) Polygon GND
(LINE X=1.9500 Y=1.4500 ) Polygon GND
}
}
{NET=VX
(PIN X=0.1500 Y=0.7000 R=TP1.TP P=SMD001) VX, Smd Dx: 0.0394 Dy: 0.0394
(PIN X=1.8500 Y=0.7000 R=TP3.TP P=SMD001) VX, Smd Dx: 0.0394 Dy: 0.0394
* (PLG Isolate=0.0000 Spacing=0.0500 Width=0.0000 Orphans=Off Pour=SOLID Thermals=Off Layer=Top) Polygon VX Data
{POLYGON L="Top" T=POUR W=0.0000 ID=2 X=0.9000 Y=0.7500
(LINE X=0.9000 Y=1.2500 ) Polygon VX
(LINE X=1.0000 Y=1.2500 ) Polygon VX
(LINE X=1.0000 Y=0.7500 ) Polygon VX
(LINE X=1.9000 Y=0.7500 ) Polygon VX
(LINE X=1.9000 Y=0.6500 ) Polygon VX
(LINE X=0.1000 Y=0.6500 ) Polygon VX
(LINE X=0.1000 Y=0.7500 ) Polygon VX
(LINE X=0.9000 Y=0.7500 ) Polygon VX
}
}
**********************************************************************
* End of data
*
{END}
{KEY=028-015E-4E5D}
**********************************************************************
* Exports the board to HyperLynx Signal-Integrity Transfer Format (.HYP)
* Version 2.00 9/11/97 -- 4.15 12/03/2012
*
* EAGLE Version 6.3.0 Copyright (c) 1988-2012 CadSoft
*
* HyperLynx Board exported from:
* /Users/koen/logan/software/hyp2mat/eagle/tutorial/msl.brd
* At 3/28/13 2:01 PM
*
* Schematic is loaded.
*
{VERSION=2.10} Compatible with Hyperlynx version 2.10.
{UNITS=ENGLISH LENGTH}
**********************************************************************
* Board Dimensions
*
{BOARD
(PERIMETER_SEGMENT X1=0.0000 Y1=0.0000 X2=0.7874 Y2=0.0000) Wires: From Board
(PERIMETER_SEGMENT X1=0.7874 Y1=0.0000 X2=0.7874 Y2=0.7874) Wires: From Board
(PERIMETER_SEGMENT X1=0.7874 Y1=0.7874 X2=0.0000 Y2=0.7874) Wires: From Board
(PERIMETER_SEGMENT X1=0.0000 Y1=0.7874 X2=0.0000 Y2=0.0000) Wires: From Board
}
**********************************************************************
* Thickness of Copper and Dielectric Layer Data
*
{STACKUP
(SIGNAL T=0.00140 P=0.00140 L=Top)
(DIELECTRIC T=0.01259 C=4.80000 L=DL01)
(SIGNAL T=0.00140 P=0.00140 L=Bottom)
(DIELECTRIC T=0.05970 C=4.80000 L=DL02)
}
* Total Board Thickness 0.0625 inch
**********************************************************************
* Components
*
{DEVICES
(C REF="C1" VAL=100n L="Top") R000 X=0.3937 Y=0.3937 : Lib: msl : C0402K : Pins 2
(? REF="TP1" NAME="TPTP06SQ" L="Top") R000 X=0.0787 Y=0.3937 : Lib: msl : TP06SQ : Pins 1
(? REF="TP2" NAME="TPTP06SQ" L="Top") R000 X=0.7087 Y=0.3937 : Lib: msl : TP06SQ : Pins 1
(? REF="TP3" NAME="TPTP06SQ" L="Bottom") R000 X=0.0787 Y=0.3937 : Lib: msl : TP06SQ : Pins 1
(? REF="TP4" NAME="TPTP06SQ" L="Bottom") R000 X=0.7087 Y=0.3937 : Lib: msl : TP06SQ : Pins 1
}
**********************************************************************
* Pads, Smds, and Via Library
*
{PADSTACK=SMD001
(Top,1,0.035,0.028,0.0) ISASMD Shape was Smd and is now Smd
}
{PADSTACK=SMD002
(Top,1,0.004,0.004,0.0) ISASMD Shape was Smd and is now Smd
}
{PADSTACK=SMD003
(Bottom,1,0.004,0.004,180.0) ISASMD Shape was Smd and is now Smd
}
**********************************************************************
* Nets
*
{NET=GND
(PIN X=0.0787 Y=0.3937 R=TP3.TP P=SMD003) GND, Smd Dx: 0.0040 Dy: 0.0040
(PIN X=0.7087 Y=0.3937 R=TP4.TP P=SMD003) GND, Smd Dx: 0.0040 Dy: 0.0040
* (PLG Isolate=0.0000 Spacing=0.0500 Width=0.0000 Orphans=Off Pour=SOLID Thermals=Off Layer=Bottom) Polygon GND Data
{POLYGON L="Bottom" T=POUR W=0 ID=1 X=0.7474 Y=0.0400
(LINE X=0.0400 Y=0.0400 ) Polygon GND
(LINE X=0.0400 Y=0.7474 ) Polygon GND
(LINE X=0.7474 Y=0.7474 ) Polygon GND
(LINE X=0.7474 Y=0.0400 ) Polygon GND
}
{POLYVOID ID=1 X=0.4449 Y=0.3720
(LINE X=0.4449 Y=0.4154 ) Polygon GND
(LINE X=0.4449 Y=0.4154 ) Polygon GND
(LINE X=0.3425 Y=0.4154 ) Polygon GND
(LINE X=0.3425 Y=0.4154 ) Polygon GND
(LINE X=0.3425 Y=0.3720 ) Polygon GND
(LINE X=0.3425 Y=0.3720 ) Polygon GND
(LINE X=0.4449 Y=0.3720 ) Polygon GND
(LINE X=0.4449 Y=0.3720 ) Polygon GND
}
}
{NET=V1
(PIN X=0.0787 Y=0.3937 R=TP1.TP P=SMD002) V1, Smd Dx: 0.0040 Dy: 0.0040
(PIN X=0.3681 Y=0.3937 R=C1.1 P=SMD001) V1, Smd Dx: 0.0354 Dy: 0.0276
* (PLG Isolate=0.0000 Spacing=0.0500 Width=0.0000 Orphans=Off Pour=SOLID Thermals=Off Layer=Top) Polygon V1 Data
{POLYGON L="Top" T=POUR W=0 ID=2 X=0.3622 Y=0.3957
(LINE X=0.3622 Y=0.3917 ) Polygon V1
(LINE X=0.0768 Y=0.3917 ) Polygon V1
(LINE X=0.0768 Y=0.3957 ) Polygon V1
(LINE X=0.3622 Y=0.3957 ) Polygon V1
}
}
{NET=V2
(PIN X=0.4193 Y=0.3937 R=C1.2 P=SMD001) V2, Smd Dx: 0.0354 Dy: 0.0276
(PIN X=0.7087 Y=0.3937 R=TP2.TP P=SMD002) V2, Smd Dx: 0.0040 Dy: 0.0040
* (PLG Isolate=0.0000 Spacing=0.0500 Width=0.0000 Orphans=Off Pour=SOLID Thermals=Off Layer=Top) Polygon V2 Data
{POLYGON L="Top" T=POUR W=0 ID=3 X=0.7106 Y=0.3957
(LINE X=0.7106 Y=0.3917 ) Polygon V2
(LINE X=0.4134 Y=0.3917 ) Polygon V2
(LINE X=0.4134 Y=0.3957 ) Polygon V2
(LINE X=0.7106 Y=0.3957 ) Polygon V2
}
}
**********************************************************************
* End of data
*
{END}
{KEY=028-015E-4E5D}
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